# AMD Confirms Zen 6 Epyc 9006 LP Verano CPU Details

October 5, 2026 at 05:02 PM

> AMD's upcoming Verano CPUs will feature the new SB1 socket and Zen 6 architecture with up to 72 cores for rack-scale AI solutions.

[AMD](<https://hardwarebrief.com/entity/amd-q128896>) has confirmed that its upcoming **Verano** CPU family, officially designated as **Epyc 9006 LP**, will utilize the new SB1 socket. Based on the [Zen 6](<https://hardwarebrief.com/entity/zen-6-q130259990>) architecture, these processors feature up to 72 cores and achieve turbo clock speeds reaching 5 GHz for AI tasks.

Cooler manufacturer **Dynatron** revealed the SB1 socket name through its SB1-4U-ACTIVE cooling solution. Unlike standard Epyc 9006 chips using SP7 or SP8 sockets, Verano integrates LPDDR5X memory that is fully exchangeable via a specialized SOCAMM2 socket design.

Targeted at rack-scale AI solutions, the Verano platform aims to balance high-performance computing with efficient memory scaling. AMD expects these Zen 6 systems to be available by 2027, offering a modular approach to memory for next-generation data centers.


[#AMD](<https://hardwarebrief.com/hashtag/amd>) [#Zen6](<https://hardwarebrief.com/hashtag/zen6>) [#EPYC](<https://hardwarebrief.com/hashtag/epyc>) [#DataCenter](<https://hardwarebrief.com/hashtag/datacenter>) [#AI](<https://hardwarebrief.com/hashtag/ai>)

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