# Anthropic Develops Custom AI Chip with Samsung

October 8, 2026 at 08:59 AM

> Anthropic partners with Samsung and Broadcom to produce a 2nm AI accelerator featuring 4,000 TOPS of compute and HBM3E memory.

[Anthropic](<https://hardwarebrief.com/entity/anthropic-q116758847>) is developing a custom AI accelerator utilizing [Samsung](<https://hardwarebrief.com/entity/samsung-electronics-q20718>)'s SF2 2nm node, with [Broadcom](<https://hardwarebrief.com/entity/broadcom-q790060>) managing the ASIC design and implementation. The initial production run targets 200,000 units manufactured in [South Korea](<https://hardwarebrief.com/entity/south-korea-q884>) using Low-NA EUV lithography technology.

The high-performance ASIC delivers 4,000 TOPS of INT8 compute with a 1,300 W TDP. It features either 192 GB or 288 GB of HBM3E memory. Samsung will utilize its I-Cube 2.5D packaging, while a new 2.1D alliance with [Qualcomm](<https://hardwarebrief.com/entity/qualcomm-q544847>) introduces organic bridge materials.

This hardware push signals Anthropic's move toward vertical integration to scale its AI infrastructure. As Samsung expands with a new facility in Taylor, Texas, these advanced nodes and packaging alliances are critical for next-generation compute efficiency.


#Anthropic [#Samsung](<https://hardwarebrief.com/hashtag/samsung>) #AIHardware [#Semiconductors](<https://hardwarebrief.com/hashtag/semiconductors>) #ASIC

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