[#LPDDR](<https://hardwarebrief.com/hashtag/lpddr>) [#CXMT](<https://hardwarebrief.com/hashtag/cxmt>) [#Xiaomi](<https://hardwarebrief.com/hashtag/xiaomi>)



# CXMT Mass Produces LPDDR6 for Xiaomi 18 Fold

August 29, 2026 at 10:07 AM

> Xiaomi 18 Fold will debut CXMT's LPDDR6 memory alongside the Xring O3 SoC to set a new performance standard for mobile devices.

**CXMT** has officially confirmed that its next-generation **LPDDR6** memory has entered mass production. **Xiaomi** founder Lei Jun announced via Weibo that the company will be the first to adopt the new modules, debuting them in the upcoming Xiaomi 18 Fold smartphone.

The Xiaomi 18 Fold will feature the Xring O3 SoC, a flagship processor built on TSMC's 3nm process. Reports indicate the device includes a 7.6-inch display, a 200MP primary camera, and a 6,000mAh battery with wireless charging support for its September launch.

LPDDR6 succeeds LPDDR5X, offering a 24-bit interface with speeds reaching 12,800 MT/s. While the Xring O3 implementation runs at 10,667 MT/s, this hardware shift signals a new performance standard for mobile devices like the rumored Xiaomi Pad 9 Pro Max.



## Related news

[#CXMT](<https://hardwarebrief.com/hashtag/cxmt>) #HBM3E [#Semiconductors](<https://hardwarebrief.com/hashtag/semiconductors>) #MemoryTech [#TechNews](<https://hardwarebrief.com/hashtag/technews>)

October 29, 2026 at 02:31 PM

## [CXMT to Mass Produce HBM3E Memory by Late 2026](<https://hardwarebrief.com/article/cxmt-to-mass-produce-hbm3e-memory-by-late-2026-342cef74>)

> CXMT targets late 2026 for HBM3E mass production as the firm works to improve yield rates and scale high-bandwidth memory capacity.

[#Xiaomi](<https://hardwarebrief.com/hashtag/xiaomi>) #RedmiBook2027 [#IntelWildcatLake](<https://hardwarebrief.com/hashtag/intelwildcatlake>) #TechLaunch [#Laptops](<https://hardwarebrief.com/hashtag/laptops>)

October 22, 2026 at 04:26 PM

## [Xiaomi to Launch Redmi Book 2027 Series Oct 27](<https://hardwarebrief.com/article/xiaomi-to-launch-redmi-book-2027-series-oct-27-97b40ea7>)

> Xiaomi's new Redmi Book 14 and 16 laptops will debut in China featuring Intel Wildcat Lake processors and redesigned productivity features.

[#CXMT](<https://hardwarebrief.com/hashtag/cxmt>) [#Semiconductors](<https://hardwarebrief.com/hashtag/semiconductors>) [#NANDFlash](<https://hardwarebrief.com/hashtag/nandflash>) [#TechNews](<https://hardwarebrief.com/hashtag/technews>) #MemoryStorage

September 23, 2026 at 05:39 PM

## [CXMT Expands Into NAND Flash Production](<https://hardwarebrief.com/article/cxmt-expands-into-nand-flash-production-c6d8fdc6>)

> Chinese memory maker CXMT is reportedly building a new R&D line near Beijing to expand its semiconductor operations into NAND flash.

[#CXMT](<https://hardwarebrief.com/hashtag/cxmt>) [#DRAM](<https://hardwarebrief.com/hashtag/dram>) #LPDDR5X [#Semiconductors](<https://hardwarebrief.com/hashtag/semiconductors>) [#TechNews](<https://hardwarebrief.com/hashtag/technews>)

September 22, 2026 at 01:41 PM

## [CXMT Mass Produces 5th-Gen DRAM Platform](<https://hardwarebrief.com/article/cxmt-mass-produces-5th-gen-dram-platform-54c1d5f9>)

> Chinese manufacturer CXMT launches high-density 24Gb LPDDR5X chips using quadruple patterning to boost capacity and reduce power usage.

[#Asus](<https://hardwarebrief.com/hashtag/asus>) #AM5 [#DDR5](<https://hardwarebrief.com/hashtag/ddr5>) [#CXMT](<https://hardwarebrief.com/hashtag/cxmt>) [#PCGaming](<https://hardwarebrief.com/hashtag/pcgaming>)

September 20, 2026 at 10:00 AM

## [ASUS Updates AM5 BIOS for CXMT DDR5 Memory](<https://hardwarebrief.com/article/asus-updates-am5-bios-for-cxmt-ddr5-memory-28f4e1f2>)

> ASUS releases new AGESA 1.3.0.1d BIOS updates featuring low-latency tuning and improved timings for CXMT-based DDR5 memory modules.

[#CXMT](<https://hardwarebrief.com/hashtag/cxmt>) #3DNAND [#Semiconductors](<https://hardwarebrief.com/hashtag/semiconductors>) #MemoryTech [#TechNews](<https://hardwarebrief.com/hashtag/technews>)

September 19, 2026 at 11:12 AM

## [CXMT Plans 3D NAND R&D Line at Beijing Facility](<https://hardwarebrief.com/article/cxmt-plans-3d-nand-r-d-line-at-beijing-facility-cefb1359>)

> ChangXin Memory Technologies aims to diversify its portfolio by establishing a 3D NAND production line at its second Beijing site.

[#Xiaomi](<https://hardwarebrief.com/hashtag/xiaomi>) #XringO3 #MobileGaming [#Semiconductors](<https://hardwarebrief.com/hashtag/semiconductors>) [#TechNews](<https://hardwarebrief.com/hashtag/technews>)

September 18, 2026 at 12:16 PM

## [Xiaomi Xring O3 Chip Adds Native BCn Support](<https://hardwarebrief.com/article/xiaomi-xring-o3-chip-adds-native-bcn-support-4ed0583c>)

> Xiaomi's new Xring O3 chip enables native BCn texture decoding to improve efficiency for desktop game engines and Windows-on-ARM software.

[#CXMT](<https://hardwarebrief.com/hashtag/cxmt>) [#HBM](<https://hardwarebrief.com/hashtag/hbm>)

September 9, 2026 at 11:55 AM

## [CXMT Begins Production of HBM3 Memory Chips](<https://hardwarebrief.com/article/cxmt-begins-production-of-hbm3-memory-chips-dff72353>)

> Chinese firm CXMT starts HBM3 production with eight-layer DRAM stacks while navigating manufacturing yields between 25% and 30%.

[#CXMT](<https://hardwarebrief.com/hashtag/cxmt>) [#Xiaomi](<https://hardwarebrief.com/hashtag/xiaomi>) [#LPDDR](<https://hardwarebrief.com/hashtag/lpddr>)

September 9, 2026 at 09:58 AM

## [CXMT Launches LPDDR6 Memory in Xiaomi 18 Fold](<https://hardwarebrief.com/article/cxmt-launches-lpddr6-memory-in-xiaomi-18-fold-34e52c9c>)

> CXMT debuts its LPDDR6 memory in the Xiaomi 18 Fold, offering 12,800 Mbps data rates and 20% lower power consumption than LPDDR5X.

#SemiconductorIndustryInChina [#CXMT](<https://hardwarebrief.com/hashtag/cxmt>) #YMTC

September 8, 2026 at 10:17 AM

## [Chinese Chipmakers Stockpile ASML Lithography Tools](<https://hardwarebrief.com/article/chinese-chipmakers-stockpile-asml-lithography-tools-0cf964a4>)

> CXMT and YMTC secure critical DUV systems for expansion as the U.S. pushes for stricter export bans on semiconductor manufacturing gear.