# CXMT to Mass Produce HBM3E Memory by Late 2026 October 29, 2026 at 02:31 PM > CXMT targets late 2026 for HBM3E mass production as the firm works to improve yield rates and scale high-bandwidth memory capacity. **CXMT** is set to begin mass production of its first **HBM3E** memory modules by the end of 2026, following risk production that started in August. The company has already begun shipping standard and updated design versions to customers to improve current yields. The HBM3E standard features a 1,024-bit width with speeds up to 12.4 Gbps and 1.2 TB/s bandwidth. CXMT is utilizing an 8-high configuration with 3,000 **TSVs** per layer, though performance is reportedly closer to **SK hynix** HBM3 than the newer HBM3E generation. Yield rates remain a significant hurdle, with reported figures currently at 20%. CXMT achieves 30% yield in front-end manufacturing with an additional 70% in back-end processing. These efforts are critical as the firm scales its high-bandwidth memory capacity. [#CXMT]() #HBM3E [#Semiconductors]() #MemoryTech [#TechNews]() ## Related news ## [Samsung Unveils Enhanced 8LPU+ Chip Process]() October 27, 2026 at 06:00 PM ## [Intel and AMD Form x86 Ecosystem Advisory Group]() October 26, 2026 at 10:40 AM ## [SK hynix Cancels Solidigm IPO Plans]() October 23, 2026 at 02:06 PM ## [Micron Abandons 4F² DRAM Architecture Research]() October 22, 2026 at 07:22 PM ## [Intel Begins Tooling at New Arizona Fab 62]() October 21, 2026 at 06:13 PM