# GlobalFoundries and TSMC Sign $2B Supply Deal

October 9, 2026 at 09:27 AM

> GlobalFoundries will produce silicon interposers for TSMC's advanced packaging ecosystem under a new five-year manufacturing agreement.

[GlobalFoundries](<https://hardwarebrief.com/entity/globalfoundries-q691592>) and [TSMC](<https://hardwarebrief.com/entity/tsmc-q713418>) have signed a five-year manufacturing agreement valued at $2 billion. GlobalFoundries will produce silicon interposers for TSMC's CoWoS-S advanced packaging ecosystem, with volume production scheduled to begin in the first half of 2028.

GlobalFoundries will expand capacity at its [Malta, New York](<https://hardwarebrief.com/entity/malta-new-york-q3708930>), facility to act as a subcontractor for customer-specific interposer designs. These components provide high-density connections between logic chiplets and high-bandwidth memory stacks for processors.

The deal establishes a framework for expansion based on demand as TSMC plans to bring CoWoS capabilities to [Arizona](<https://hardwarebrief.com/entity/arizona-q816>) before 2029. This follows a 10-year TSMC deal with [Amkor Technology](<https://hardwarebrief.com/entity/amkor-technology-q472536>), while Micron and SK hynix plan U.S. memory assembly sites this decade.


#GlobalFoundries [#TSMC](<https://hardwarebrief.com/hashtag/tsmc>) [#Semiconductors](<https://hardwarebrief.com/hashtag/semiconductors>) #CoWoS [#TechNews](<https://hardwarebrief.com/hashtag/technews>)

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