# GlobalFoundries Unveils 7nm FDX Fusion Process

October 12, 2026 at 03:54 PM

> GlobalFoundries returns to advanced nodes with a 7nm FD-SOI platform targeting automotive and edge AI sectors for 2028 production.

[GlobalFoundries](<https://hardwarebrief.com/entity/globalfoundries-q691592>) has announced FDX Fusion, a new 7nm-class manufacturing process utilizing planar transistors and fully-depleted silicon-on-insulator technology. This marks a strategic return to advanced nodes after the firm halted 7nm FinFET development in 2018.

The platform targets automotive, edge AI, and industrial sectors, offering double the density of the 2015-era 22FDX node. It supports RF transistors up to 0.5 THz and various IP architectures like RISC-V, with initial demo silicon expected for customers in 2027.

Major industry players including [Tesla](<https://hardwarebrief.com/entity/tesla-inc-q478214>), [BMW](<https://hardwarebrief.com/entity/bmw-q26678>), and [Bosch](<https://hardwarebrief.com/entity/bosch-company-q234021>) have expressed interest in the technology. Production is slated for 2028 at the Dresden facility, where [Infineon](<https://hardwarebrief.com/entity/infineon-technologies-q311394>) will collaborate on 7nm-class solutions for radar and next-generation wireless communications.


[#GlobalFoundries](<https://hardwarebrief.com/hashtag/globalfoundries>) [#Semiconductors](<https://hardwarebrief.com/hashtag/semiconductors>) #FDSOI #EdgeAI #AutomotiveTech

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