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# Huawei Unveils LogicFolding Chip Architecture

October 15, 2026 at 10:49 AM

> Huawei's new LogicFolding technology achieves a 53.5 percent density boost using SMIC's 7nm process despite ongoing hardware restrictions.

**Huawei** announced its new **LogicFolding** architecture in May 2026, marking a significant leap in semiconductor design. The technology integrates over 50 million hybrid bonds to improve transistor density by 53.5 percent, according to executive **Xu Songyu**.

The **Kirin 9050** series was the first to adopt this architecture, and early test results for a 2027 Kirin SoC have already met internal targets. Despite lacking access to ASML's specialized EUV machinery, Huawei continues to utilize **SMIC**'s 7nm DUV equipment.

Since the Kirin 9000S launch in August 2023, Huawei has shipped 100 million chipsets, primarily in China. While the company faces a current DRAM shortage, these architectural gains are critical as they navigate ongoing restrictions on advanced hardware.



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