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# Intel and AUO Partner on Co-Packaged Optics

September 22, 2026 at 08:43 AM

> Intel and AU Optronics collaborate to advance high-density chip layouts and glass substrate technology for next-generation integration.

**Intel** is reportedly partnering with Taiwanese manufacturer **AU Optronics** to develop Co-Packaged Optics and massively integrated chips. The collaboration focuses on high-density chip layouts and Micro LED substrates, though Intel has declined to comment.

AU Optronics has confirmed its entry into advanced packaging and glass substrates, offering an ecosystem for **optical interconnects**. Intel recently secured a U.S. patent for embedding **semiconductor** chips within glass substrates using Through-Glass-Vias.

This strategic shift pairs Intel's EMIB packaging and glass-substrate ambitions with AUO's expertise in Redistribution Layers and Micro LED technology. The joint effort aims to advance next-generation optical integration and high-performance chip design.



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