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# Intel Nova Lake-H Features Six-Tile Modular Design

November 5, 2026 at 02:45 PM

> Intel's Core Ultra 4000H Nova Lake-H processor utilizes a multi-foundry approach with TSMC N2P and Intel 18A-P nodes in a six-tile layout.

**Intel**'s upcoming **Nova Lake-H** processor, part of the **Core Ultra 4000H** family, features a modular six-tile design. The 12 x 23 mm package includes a 55 mm2 Compute Tile with 4 P-cores and 8 E-cores, alongside a 72 mm2 Hub/SoC tile containing four LP E-cores.

The architecture utilizes diverse nodes: the Compute Tile uses **TSMC** N2P, while the Hub/SoC and 58 mm2 Peripheral Controller tiles use Intel 18A-P. A 26 mm2 Graphics Tile with four Xe3 cores uses Intel 3-E, supported by two passive tiles for structural integrity.

For high-end performance, the Nova Lake-HX variant scales to an 8P+16E configuration with a larger 104 mm2 Compute tile and a 12 x 30 mm package. This multi-foundry approach highlights Intel's strategy of mixing internal and external manufacturing processes.



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