# Intel Nova Lake Mobile CPU Die Details Leaked

October 16, 2026 at 11:32 AM

> Leaked specifications reveal Intel's Nova Lake-HX flagship features a 360 mm² area and a 104 mm² compute tile built on TSMC's N2P node.

The **Moore's Law Is Dead** YouTube channel has revealed **Intel**'s upcoming **Nova Lake** mobile lineup in bare-die form. The flagship **Nova Lake-HX** features an 8+16+4 core configuration across six dies, totaling a 360 mm² area within a 12x30 mm physical package size.

The HX variant utilizes a 104 mm² main compute tile on **TSMC**'s N2P node for its 8P+16E cores. It also includes an Intel 18A-P central hub with 4 LPE-Cores, a 58 mm² peripheral tile, and a 26 mm² graphics tile with 4 Xe cores manufactured on the Intel 3-E node.

The smaller Nova Lake-H variant uses a 4+8+4 core setup in a 12x23 mm package. While it shares the same 18A-P hub and graphics tile as the HX, its N2P compute tile is reduced to 55 mm². Both chips use dummy and passive dies to ensure package structural integrity.


[#Intel](<https://hardwarebrief.com/hashtag/intel>) [#NovaLake](<https://hardwarebrief.com/hashtag/novalake>) [#TSMC](<https://hardwarebrief.com/hashtag/tsmc>) [#CPU](<https://hardwarebrief.com/hashtag/cpu>) #TechLeaks

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