# Intel Unveils Core Ultra 4000 Nova Lake Details

October 21, 2026 at 12:23 PM

> Intel reveals its flagship Core Ultra 9 4995HX mobile chip featuring 28 cores and TSMC N2P technology ahead of a planned CES 2027 launch.

**Intel** has unveiled details for its upcoming **Nova Lake** flagship mobile chips, part of the Core Ultra 4000 family. The lineup features the **Core Ultra 9 4995HX** with 28 cores and 28 threads, alongside the 16-core Core Ultra 9 4970H, both expected by **CES 2027**.

The 4995HX utilizes 8 Coyote Cove P-Cores and 16 Arctic Wolf E-Cores, plus 4 LP-E cores and a massive 144MB BFC cache. Built on **TSMC** N2P process technology, these single compute tile CPUs scale up to 160W for HX models and 115W for the H-series variants.

These chips represent a significant architectural shift, integrating Xe3 and Xe3P iGPU cores into high-performance mobile silicon. With the 4995HX measuring 14.8mm x 6.6mm, Intel aims to deliver dense, high-wattage computing for the next generation of laptops.


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