# Micron Unveils Roadmap for DDR6 and 400-Layer NAND

October 22, 2026 at 03:09 PM

> Micron Technology announces its 1-Delta DRAM node and G11 NAND roadmap to significantly boost memory bandwidth and density for data centers.

**Micron Technology** has unveiled its comprehensive roadmap for DRAM, HBM, and NAND products, highlighting the upcoming **1-Delta DRAM** node. This node, manufactured in the U.S., succeeds 1y technology and enables **DDR6** memory to double the bandwidth of DDR5.

The 1-Delta node features advanced HKMG CMOS and 6F2 DRAM, offering a mid-20s percentage bit density improvement. Micron is also developing **G11 NAND** with over 400 layers, aiming for twice the bit density and 1.5x IO speed uplifts over G9 by late 2027.

These innovations, including LPDDR6 with 35% better efficiency and **HBM6**, address scaling needs for future data centers. With 400 times more bits per wafer than in 1995, Micron is leveraging High-NA EUV and 3D DRAM to maintain its leadership in memory.


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