# Microsoft Unveils Maia 300 AI Accelerator Chip

October 12, 2026 at 06:14 PM

> Microsoft's new Maia 300 chip features 288 GB of HBM4 memory and targets massive AI scaling with production scheduled for 2027.

[Microsoft](<https://hardwarebrief.com/entity/microsoft-q2283>) has unveiled the **Maia 300**, a third-generation AI accelerator featuring 288 GB of [HBM4](<https://hardwarebrief.com/entity/high-bandwidth-memory-q20723936>) memory and 18 TB/s of bandwidth. Built on [TSMC](<https://hardwarebrief.com/entity/tsmc-q713418>)'s N2P process with a multi-chiplet design, the 950W chip delivers up to 13.8 PFLOPS of FP4 compute performance.

The hardware succeeds the 2026 Maia 200, offering 6.9 PFLOPS at FP8 precision. Utilizing eight HBM4 stacks and a two-tier Ethernet network, the architecture supports clusters of 12,000 units. Production deployment for the new silicon is scheduled for 2027.

This launch targets massive scale, with [Reuters](<https://hardwarebrief.com/entity/reuters-q130879>) reporting potential deployment of one million chips. Microsoft claims the Maia 300 provides 40% more tokens per megawatt than top GPUs, while a 96-chip rack delivers seven times the throughput of its predecessor.


[#Microsoft](<https://hardwarebrief.com/hashtag/microsoft>) #Maia300 [#AIHardware](<https://hardwarebrief.com/hashtag/aihardware>) [#Semiconductors](<https://hardwarebrief.com/hashtag/semiconductors>) #CloudComputing

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