# NVIDIA to Adopt Intel Foveros 3D Packaging

October 9, 2026 at 08:12 PM

> NVIDIA is expected to utilize Intel's Foveros 3D chip packaging technology for AI GPU production starting in the second half of 2028.

[NVIDIA](<https://hardwarebrief.com/entity/nvidia-q182477>) may adopt [Intel](<https://hardwarebrief.com/entity/intel-q248>)'s **Foveros** 3D chip packaging technology in the second half of 2028, according to [GF Securities](<https://hardwarebrief.com/entity/gf-securities-q11061887>) analyst **Jeff Pu**. This potential partnership follows earlier reports from DigiTimes suggesting NVIDIA will utilize Intel's 14A manufacturing.

Intel's Foveros technology stacks computing tiles vertically on a base die, reducing the horizontal footprint compared to the side-by-side EMIB layout. This backend process follows the frontend fabrication, which defines the product's computing capability.

The shift highlights Intel's growing role in advanced AI GPU fabrication. While Google reportedly tapped Intel's EMIB-T technology earlier in 2026, NVIDIA's move to Foveros would coincide with the production launch of Intel's next-generation 14A process.


[#Nvidia](<https://hardwarebrief.com/hashtag/nvidia>) [#Intel](<https://hardwarebrief.com/hashtag/intel>) #Foveros #AIGPU [#Semiconductors](<https://hardwarebrief.com/hashtag/semiconductors>)

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