# Samsung Completes HBM4E Testing for NVIDIA

October 7, 2026 at 12:36 PM

> Samsung Electronics finishes qualification testing for its 12-layer HBM4E memory, offering 48GB capacity for AI infrastructure.

[Samsung Electronics](<https://hardwarebrief.com/entity/samsung-electronics-q20718>) has reportedly completed qualification testing for its 12-layer **HBM4E** memory with [NVIDIA](<https://hardwarebrief.com/entity/nvidia-q182477>) and several major hyperscalers. According to [Hankyung](<https://hardwarebrief.com/entity/the-korea-economic-daily-q626241>), the testing concluded in late September, following the initial sampling phase started in May.

The 12-layer HBM4E stack offers 48GB capacity and 3.6 TB/s bandwidth, utilizing Samsung’s 1c DRAM and a 4nm logic base die. Operating at 14 Gbps per pin with scaling potential to 16 Gbps, it delivers a 20% performance boost over the previous HBM4 generation.

This milestone follows the 2026 mass production of HBM4 for NVIDIA’s [Vera Rubin](<https://hardwarebrief.com/entity/rubin-microarchitecture-q126888620>) platform. While Samsung declined to confirm the specific qualification status to reporters, the hardware represents a critical leap in high-performance memory for AI infrastructure.


[#Samsung](<https://hardwarebrief.com/hashtag/samsung>) [#Nvidia](<https://hardwarebrief.com/hashtag/nvidia>) #HBM4E #AIHardware [#Semiconductors](<https://hardwarebrief.com/hashtag/semiconductors>)

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