[#Xiaomi](<https://hardwarebrief.com/hashtag/xiaomi>)



# Xiaomi Unveils 3nm XRING Chips and AI Cube PC

August 26, 2026 at 11:44 AM

> Xiaomi debuts the XRING O3 smartphone SoC and AI Cube prototype, marking a major expansion into high-performance edge AI and automotive silicon.

**Xiaomi** unveiled three new chips and the AI Cube mini PC prototype on August 24, 2026. The flagship XRING O3 smartphone SoC, built on a 3nm process with 24 billion transistors, scored 5.22 million on AnTuTu V11 and features a 60-micrometer hand sign engraving.

The lineup includes the XRING O100 AI chip with 1.22TB/s bandwidth and the XRING D100 autonomous driving SoC supporting 200B parameter models. The AI Cube prototype integrates all three chips with 80GB unified memory and 150W dissipation in an aluminum chassis.

Mass production for the XRING O3 has begun for the Xiaomi 18 Fold and Pad 9 Pro Max. The O100 and D100 chips are slated for 2027 deployment, representing a major push into edge AI and automotive silicon with advanced 3nm and wafer-on-wafer packaging tech.



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