# #AIChips in the news

September 30, 2026 at 06:00 PM

> Samsung Foundry Losses to Shrink 42% in 2026 · Samsung Doubles Glass Carrier Orders for HBM4 · Huawei Unveils Ascend AI Chip Roadmap Through 2029

[Samsung Foundry Losses to Shrink 42% in 2026](<https://hardwarebrief.com/article/samsung-foundry-losses-to-shrink-42-in-2026-1ab2e9ca>)
*September 30, 2026 at 06:00 PM* - Samsung Electronics expects a significant recovery in its foundry business as high demand for advanced nodes drives down operating losses.

[Samsung Doubles Glass Carrier Orders for HBM4](<https://hardwarebrief.com/article/samsung-doubles-glass-carrier-orders-for-hbm4-6a921412>)
*September 21, 2026 at 02:59 PM* - Samsung is scaling glass carrier procurement to 50,000 units by 2027 to support HBM4 production for NVIDIA's Vera Rubin AI GPU lineup.

[Huawei Unveils Ascend AI Chip Roadmap Through 2029](<https://hardwarebrief.com/article/huawei-unveils-ascend-ai-chip-roadmap-through-2029-6309a28a>)
*September 18, 2026 at 08:52 AM* - Huawei announces the Ascend 960 and 980 AI chips, focusing on HBM capacity and optical interconnects for supercomputing architectures.