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# #IBM

> Rapidus Targets 2-nm Chip Mass Production by 2027 · LTO Tape Shipments Reach 160.3 Exabytes in 2025 · IBM Unveils Next-Gen Z Chip with Dual Arm ISA

![Rapidus Targets 2-nm Chip Mass Production by 2027](<https://hardwarebrief.com/images/2027_ben_indul_a_japan_2_nanometeres_chipgyartas_85344ab0_997693fb8e.webp>)

#Rapidus [#Semiconductors](<https://hardwarebrief.com/hashtag/semiconductors>) #JapanTech [#IBM](<https://hardwarebrief.com/hashtag/ibm>) #ChipManufacturing

November 12, 2026 at 04:11 PM

## [Rapidus Targets 2-nm Chip Mass Production by 2027](<https://hardwarebrief.com/article/rapidus-targets-2-nm-chip-mass-production-by-2027-a95a4e3d>)

> Japanese startup Rapidus aims to revitalize domestic silicon manufacturing by producing advanced 2-nm chips using IBM technology by 2027.

#LTO #HPE [#IBM](<https://hardwarebrief.com/hashtag/ibm>) #QuantumCorporation

September 3, 2026 at 08:27 PM

## [LTO Tape Shipments Reach 160.3 Exabytes in 2025](<https://hardwarebrief.com/article/lto-tape-shipments-reach-160-3-exabytes-in-2025-d6562266>)

> LTO Program providers report 160.3 exabytes shipped in 2025 as the roadmap expands to LTO-14 with 1,440TB of compressed storage capacity.

#IBMZ [#IBM](<https://hardwarebrief.com/hashtag/ibm>) #ARMArchitectureFamily

August 24, 2026 at 11:18 AM

## [IBM Unveils Next-Gen Z Chip with Dual Arm ISA](<https://hardwarebrief.com/article/ibm-unveils-next-gen-z-chip-with-dual-arm-isa-74f16671>)

> IBM's new 2nm processor natively executes Z and Arm software to support high-performance enterprise workloads and global banking systems.
