Frore Systems has unveiled LiquidJet Diamond, a cooling solution for enterprise AI that integrates diamond wafers into the bottom of the coldplate. The design utilizes a 3D ultra-short-loop multi-stage system to manage high-performance hardware demands.
The new implementation lowers temperatures by an additional 10C compared to the original LiquidJet, which already offered a 12C reduction in GPU die temperature. Frore Systems will demonstrate the technology at OCP 2026 using a 2300W solution.
LiquidJet Diamond boosts tokens per watt and AI revenue generation by 35% over traditional skived coldplates. This efficiency is critical for massive chips like the 1488mm2 and the 46,225mm2 , which face extreme hotspot densities.