Samsung Foundry Losses to Shrink 42% in 2026
- Samsung Electronics expects a significant recovery in its foundry business as high demand for advanced nodes drives down operating losses.
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Samsung Foundry Losses to Shrink 42% in 2026 · Samsung Doubles Glass Carrier Orders for HBM4 · Huawei Unveils Ascend AI Chip Roadmap Through 2029
Samsung Doubles Glass Carrier Orders for HBM4
- Samsung is scaling glass carrier procurement to 50,000 units by 2027 to support HBM4 production for NVIDIA's Vera Rubin AI GPU lineup.
Huawei Unveils Ascend AI Chip Roadmap Through 2029
- Huawei announces the Ascend 960 and 980 AI chips, focusing on HBM capacity and optical interconnects for supercomputing architectures.