Samsung is significantly scaling its glass carrier orders, doubling monthly procurement from 10,000 units in 2025 to 20,000 in 2026. Projections indicate a further 2.5-fold increase to 50,000 units per month by 2027 to support expanding high-bandwidth memory output.
These glass carriers are essential for DRAM production, serving to hold wafers securely during the HBM assembly process. Samsung has already provided HBM samples to NVIDIA and is utilizing its 4-nanometer process technology to manufacture HBM4 base memory dies.
The ramp-up supports NVIDIA's Vera Rubin AI GPU lineup, which utilizes HBM4 memory. With HBM production expected to grow 40% by 2028, Samsung is also exploring the use of its advanced 2-nanometer manufacturing process for future generations of HBM base dies.