Anthropic is developing a custom AI accelerator utilizing Samsung's SF2 2nm node, with Broadcom managing the ASIC design and implementation. The initial production run targets 200,000 units manufactured in South Korea using Low-NA EUV lithography technology.
The high-performance ASIC delivers 4,000 TOPS of INT8 compute with a 1,300 W TDP. It features either 192 GB or 288 GB of HBM3E memory. Samsung will utilize its I-Cube 2.5D packaging, while a new 2.1D alliance with Qualcomm introduces organic bridge materials.
This hardware push signals Anthropic's move toward vertical integration to scale its AI infrastructure. As Samsung expands with a new facility in Taylor, Texas, these advanced nodes and packaging alliances are critical for next-generation compute efficiency.