4 days

#TSMC

Intel Nova Lake-H Features Six-Tile Modular Design · TSMC Eyes 20% Price Hike for CoWoS Packaging · Intel Nova Lake Mobile CPU Die Details Leaked

4 days

Intel Nova Lake-H Features Six-Tile Modular Design

Intel's Core Ultra 4000H Nova Lake-H processor utilizes a multi-foundry approach with TSMC N2P and Intel 18A-P nodes in a six-tile layout.

13 days

TSMC may raise advanced packaging prices by 20 percent as surging AI demand strains supply and increases manufacturing complexity.

25 days

Leaked specifications reveal Intel's Nova Lake-HX flagship features a 360 mm² area and a 104 mm² compute tile built on TSMC's N2P node.

1 month

GlobalFoundries will produce silicon interposers for TSMC's advanced packaging ecosystem under a new five-year manufacturing agreement.

1 month

TSMC and Elon Musk's Terafab project are discussing a joint venture to build a comprehensive semiconductor manufacturing site in Austin.

2 months

TSMC begins A14 process pilot production in Taiwan, targeting a 2028 mass production launch for its next-generation 1.4nm technology.

2 months

A new report indicates AMD hardware prices will increase as TSMC plans a 10% manufacturing cost hike affecting GPUs and AI accelerators.

2 months

Nvidia has reportedly scheduled its Rubin-based GeForce RTX 60 series for 2027 to prioritize manufacturing capacity for AI hardware.

2 months

SMIC reached a 5.4% market share in Q2, surpassing GlobalFoundries as the fastest-growing firm among the top ten global chip manufacturers.

2 months

TSMC reports record August revenue of $16.1 billion driven by Apple's new N2-based A20 Pro and M6 chips alongside strong N3 and N5 sales.