GlobalFoundries and TSMC have signed a five-year manufacturing agreement valued at $2 billion. GlobalFoundries will produce silicon interposers for TSMC's CoWoS-S advanced packaging ecosystem, with volume production scheduled to begin in the first half of 2028.
GlobalFoundries will expand capacity at its Malta, New York, facility to act as a subcontractor for customer-specific interposer designs. These components provide high-density connections between logic chiplets and high-bandwidth memory stacks for processors.
The deal establishes a framework for expansion based on demand as TSMC plans to bring CoWoS capabilities to Arizona before 2029. This follows a 10-year TSMC deal with Amkor Technology, while Micron and SK hynix plan U.S. memory assembly sites this decade.