7 days

#CXMT

CXMT to Mass Produce HBM3E Memory by Late 2026 · CXMT Expands Into NAND Flash Production · CXMT Mass Produces 5th-Gen DRAM Platform

7 days

CXMT to Mass Produce HBM3E Memory by Late 2026

CXMT targets late 2026 for HBM3E mass production as the firm works to improve yield rates and scale high-bandwidth memory capacity.

1 month

Chinese memory maker CXMT is reportedly building a new R&D line near Beijing to expand its semiconductor operations into NAND flash.

1 month

Chinese manufacturer CXMT launches high-density 24Gb LPDDR5X chips using quadruple patterning to boost capacity and reduce power usage.

2 months

ASUS releases new AGESA 1.3.0.1d BIOS updates featuring low-latency tuning and improved timings for CXMT-based DDR5 memory modules.

2 months

ChangXin Memory Technologies aims to diversify its portfolio by establishing a 3D NAND production line at its second Beijing site.

2 months

Chinese firm CXMT starts HBM3 production with eight-layer DRAM stacks while navigating manufacturing yields between 25% and 30%.

2 months

CXMT debuts its LPDDR6 memory in the Xiaomi 18 Fold, offering 12,800 Mbps data rates and 20% lower power consumption than LPDDR5X.

2 months

CXMT and YMTC secure critical DUV systems for expansion as the U.S. pushes for stricter export bans on semiconductor manufacturing gear.

2 months

CXMT will supply LPDDR6 RAM for the Xiaomi 18 Fold, which features the first 3nm XRING 03 chipset to support the new memory standard.

2 months

Xiaomi 18 Fold will debut CXMT's LPDDR6 memory alongside the Xring O3 SoC to set a new performance standard for mobile devices.