is set to begin mass production of its first memory modules by the end of 2026, following risk production that started in August. The company has already begun shipping standard and updated design versions to customers to improve current yields.
The HBM3E standard features a 1,024-bit width with speeds up to 12.4 Gbps and 1.2 TB/s bandwidth. CXMT is utilizing an 8-high configuration with 3,000 per layer, though performance is reportedly closer to HBM3 than the newer HBM3E generation.
Yield rates remain a significant hurdle, with reported figures currently at 20%. CXMT achieves 30% yield in front-end manufacturing with an additional 70% in back-end processing. These efforts are critical as the firm scales its high-bandwidth memory capacity.