(CXMT) has unveiled technical specifications for its mass-produced memory, initially offered in a 16 GB package. The 18 Fold foldable smartphone, featuring the XRing O3 chip, is the first product to adopt the tech.
The LPDDR6 memory utilizes a 24-bit native I/O dual-channel architecture and a 1,295-ball FBGA design with High-K EMC. It supports data rates up to 12,800 Mbps, though the Xiaomi 18 Fold operates at 10,667 Mbps. The 1 TB model goes on sale in China on Sept. 10.
CXMT reports LPDDR6 provides 60% more peak bandwidth and 20% lower power consumption than LPDDR5X. Advanced features include Link ECC, On-Die ECC, and High-K EMC, which reduces thermal resistance by 40%. Dual-rail DVFS and MBIST diagnostics are also integrated.