's upcoming processor, part of the Core Ultra 4000H family, features a modular six-tile design. The 12 x 23 mm package includes a 55 mm2 Compute Tile with 4 P-cores and 8 E-cores, alongside a 72 mm2 Hub/SoC tile containing four LP E-cores.
The architecture utilizes diverse nodes: the Compute Tile uses N2P, while the Hub/SoC and 58 mm2 Peripheral Controller tiles use Intel 18A-P. A 26 mm2 Graphics Tile with four Xe3 cores uses Intel 3-E, supported by two passive tiles for structural integrity.
For high-end performance, the Nova Lake-HX variant scales to an 8P+16E configuration with a larger 104 mm2 Compute tile and a 12 x 30 mm package. This multi-foundry approach highlights Intel's strategy of mixing internal and external manufacturing processes.