AMD Gainsborough APU Leak Hints at Steam Deck 2 · PS6 Component Costs Reportedly Surge to $960 · Intel Nova Lake Mobile CPU Die Details Leaked
- A new AMD engineering sample featuring six cores and 9600 MT/s RAM has surfaced, signaling a major performance leap for handheld gaming.
- Rising RAM and NAND prices driven by AI data center demand are pushing the estimated bill of materials for Sony's PlayStation 6 higher.
- Leaked specifications reveal Intel's Nova Lake-HX flagship features a 360 mm² area and a 104 mm² compute tile built on TSMC's N2P node.
- Next-gen console production is set for 2027 as leaks reveal Xbox Helix performance leads and rising manufacturing costs for both systems.