A report from Golden Pig on Weibo indicates that memory vendors are developing high-density GDDR7 packages. These new modules could reach 32Gb and 48Gb densities between 2027 and 2028, translating to 4GB and 6GB per chip compared to current 2GB and 3GB options.
While manufacturers have not confirmed official roadmaps, these higher-density packages would allow for increased VRAM configurations without widening memory buses. Operating speeds, specific process nodes, and expected pricing for these units remain unknown.
This advancement matters because it enables higher-VRAM hardware without increasing the number of PCB packages. Such density could facilitate single-sided memory layouts, though total VRAM will still depend on memory-controller width and production costs.