Intel has published a 2022 patent detailing the integration of MicroLEDs directly into a CPU package. Published in September 2026, the design utilizes a glass substrate and through-glass vias to embed MicroLEDs that connect to a semiconductor die for power.
The patent describes a glass substrate sandwiched between package layers, with the die partially or fully embedded. Through-glass vias route signals to the die, while silicon nitride layers and glass substrates offer ten times the density of organic materials.
These MicroLEDs serve as aesthetic components or functional indicators for device operations. Intel notes the arrays can light up wording across a CPU in various colors, marking a shift toward integrated visual feedback directly on the silicon packaging.