NVIDIA and Cisco have partnered to introduce the Ultra-Dense Small Form Factor Pluggable, or USFP, a new module designed for high-performance networking. This form factor supports up to 32 electrical lanes and delivers speeds of up to 400 Gb/s per lane.
Initial products will feature 16 lanes with 6.4 terabits per second capacity, eventually scaling to 12.8 terabits. While similar in size to OSFP modules, USFP offers four times the bandwidth density of 200-gig OSFP and 1.3x the front-panel efficiency.
The collaboration builds on NVIDIA Spectrum-X and Cisco Silicon One architectures to accelerate ecosystem adoption. By improving power efficiency by 1.3x over 200-gig CERTIs, USFP addresses the power and density demands of next-generation Ethernet networks.