GlobalFoundries has announced FDX Fusion, a new 7nm-class manufacturing process utilizing planar transistors and fully-depleted silicon-on-insulator technology. This marks a strategic return to advanced nodes after the firm halted 7nm FinFET development in 2018.
The platform targets automotive, edge AI, and industrial sectors, offering double the density of the 2015-era 22FDX node. It supports RF transistors up to 0.5 THz and various IP architectures like RISC-V, with initial demo silicon expected for customers in 2027.
Major industry players including Tesla, BMW, and Bosch have expressed interest in the technology. Production is slated for 2028 at the Dresden facility, where Infineon will collaborate on 7nm-class solutions for radar and next-generation wireless communications.