Intel is reportedly partnering with Taiwanese manufacturer AU Optronics to develop Co-Packaged Optics and massively integrated chips. The collaboration focuses on high-density chip layouts and Micro LED substrates, though Intel has declined to comment.
AU Optronics has confirmed its entry into advanced packaging and glass substrates, offering an ecosystem for optical interconnects. Intel recently secured a U.S. patent for embedding semiconductor chips within glass substrates using Through-Glass-Vias.
This strategic shift pairs Intel's EMIB packaging and glass-substrate ambitions with AUO's expertise in Redistribution Layers and Micro LED technology. The joint effort aims to advance next-generation optical integration and high-performance chip design.