is reportedly partnering with Taiwanese manufacturer to develop Co-Packaged Optics and massively integrated chips. The collaboration focuses on high-density chip layouts and Micro LED substrates, though Intel has declined to comment.
AU Optronics has confirmed its entry into advanced packaging and glass substrates, offering an ecosystem for . Intel recently secured a U.S. patent for embedding chips within glass substrates using Through-Glass-Vias.
This strategic shift pairs Intel's EMIB packaging and glass-substrate ambitions with AUO's expertise in Redistribution Layers and Micro LED technology. The joint effort aims to advance next-generation optical integration and high-performance chip design.
